Jay Singh, Ph.D.
Professor and Packaging Program Director, Cal Poly State University, San Luis Obispo, CA
Education: BE Electrical Engineering (University of Pune, India); MS and PhD Packaging Science (Michigan State University, USA)
Capabilities: Expertise includes teaching, training, testing services, contract research, consulting services and legal opinion/testimony in package design, distribution environment measurement and simulation, material and package testing, package design, product-package compatibility and life cycle assessment (LCA).
Publications: Peer Reviewed Journal Articles: 88; Refereed Conference Proceedings: 22; Conference Proceedings: 46; Trade Journal Articles: 26; Book Chapters: 2; Books: 2
Competitive Grants: Over $4,000,000 from state, federal and private organizations
Professional Experience: Have served as part of consulting teams to over 100 national and international organizations. Projects include developing packaging line systems, package design for product protection, evaluating package specifications and automation for packaging. Written over 100 reports on various studies undertaken to test and evaluate packaging systems. Serve as a consultant to various law firms towards providing expert opinion and testimony in the areas of packaging machinery, damage and injury during transportation, design and evaluation of packages.
Patents: Expandable Star Piñata, US 2011/0315752 A1; Inflatable Piñata, US 2012/0028531 A1; Method and Apparatus for Measuring Container Bulge, US 2013/0057268 A1; and System, method and apparatus for making and using flex column void based packing materials, Filed 2013
Professional Honors: Global Board of Directors (2012 – present) for International Association of Packaging Research Institutes (IAPRI) and International Safe Transit Association (ISTA); Board of Directors for specright, LLC; editor-in-chief for Journal of Applied Packaging Research (2009-10); Division I Chair for committee D10.18 of American Society for Testing and Materials (ASTM, 2009 – 2010)